AMD acquires Xilinx

The Xilinx business will become the Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng. AECG will remain focused on driving leadership FPGA and Adaptive SoC and embedded product roadmaps for its core markets, now with the additional scale of the combined company and the ability to offer an expanded set of solutions, including AMD CPUs and GPUs.

AMD CEO Lisa Su said, “The acquisition of Xilinx brings together a highly complementary set of products, customers and markets combined with differentiated IP and world-class talent to create the industry’s high-performance and adaptive computing leader. Xilinx offers industry-leading FPGAs, adaptive SoCs, AI engines and software expertise that enables AMD to offer the strongest portfolio of high-performance and adaptive computing solutions in the industry and capture a larger share of the approximately $135 billion market opportunity we see across cloud, edge and intelligent devices”.

Mario Silveira, corporate vice president EMEA at AMD said, “Today marks an important day for AMD in EMEA as we join forces with Xilinx, creating the industry’s high-performance and adaptive computing leader. AMD now has the industry’s broadest product portfolio of leadership computing, graphics and adaptive SoC products. We are excited about the incredible opportunities ahead of us to better serve our customers across an expanded set of diverse markets like communications, automotive and industrial, which are the backbones of EMEA countries’ economies.” 

The acquisition provides multiple benefits, including:

·         Increasing AMD’s TAM from $80B to $135B, expanding AMD’s customer base, and diversifying AMD into new markets

o    Xilinx’s deep strategic partnerships across wired and wireless communications, automotive, industrial and test, aerospace and defense, broadcast, measurement and emulation, and consumer markets complement AMD partnerships in the PC and data center markets.

o     

·         Providing incremental scale to AMD’s R&D

o    Brings additional capabilities in advanced technology development, including leadership die stacking and packaging technology, chiplet and interconnect technology, AI and domain-specific architectures and best-of-breed software platforms.

o     

·         Further strengthening AMD’s financial model

o    Provides multiple diverse revenue streams across new end markets with long, high-margin product cycles while maintaining AMD’s industry-leading growth.

o    The transaction is expected to be accretive to non-GAAP gross and operating margins, non-GAAP EPS and free cash flow generation in the first year.