nVent electric unveils advanced liquid cooling solutions for data centres

nVent Electric has launched innovative liquid cooling solutions aimed at addressing the evolving needs of chip manufacturers. The newly unveiled modular systems are crafted to cater to both present and future cooling requirements of data centres, aligning with the burgeoning demands of AI computing.

This development has brought forward enhanced coolant distribution units (CDUs), which are now available in row and rack-based configurations. The solutions are complemented by cutting-edge technology cooling system manifolds, updated racks based on pioneering reference designs, and a comprehensive new services programme. Attendees at SC25 will witness these innovations firsthand, alongside the introduction of nVent's next-generation intelligent power distribution units (PDUs). The company will also debut the "We Do Cool Stuff" campaign, showcasing its commitment to innovation.

Capitalising on a wealth of technical expertise and collaboration with leading chip manufacturers, nVent is tackling unique challenges in the cooling and power landscape. As noted by Eric Osborn, General Manager at nVent Data Solutions, the company's dedication to advancing technology for AI chips is driven by a decade's work in the sector.

The new portfolio introduces modular row-based CDUs, advanced PDUs, and bespoke technology cooling system manifolds. These components promise a leap forward in data centre cooling infrastructure, vital for supporting the expanding AI build-out. nVent's CDU and PDU offerings are bolstered by a shared control platform, enhancing reliability and operational efficiency.

Crucial to these solutions is the company's concentration on data centre service offerings. Given the proximity of liquid and IT equipment, correct installation and maintenance prevent costly downtime. nVent's services, ranging from installation to preventive maintenance, ensure the smooth operation of data centres.

With significant experience in global installations, nVent partners with Siemens to enhance data centre infrastructure resilience, focusing on hyperscale AI capabilities. Their collaboration extends to the Open Compute Project's Project Deschutes, where nVent showcases its CDU design based on standards set by Google.

Industry luminaries from nVent, alongside representatives from NVIDIA, Lenovo, HPE, and AMD, will illuminate the future of liquid cooling in supercomputing during a joint panel presentation. In addition, Tech Talks hosted by nVent experts will answer pressing industry questions, steering data centre managers towards integrating the latest AI technologies.

Through its "We Do Cool Stuff" campaign, nVent highlights its influential role in the data centre arena. The initiative, replete with multimedia elements, invites SC25 attendees to delve into nVent's contributions to the future of data centres.

As an innovator in liquid cooling, nVent persistently addresses complex challenges faced by global cloud service providers. By harnessing its extensive portfolio and working closely with chip manufacturers and hyperscalers, nVent ensures its liquid cooling solutions are poised for the high-density computing demands of tomorrow.